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Photovoltaic silver paste
Photovoltaic silver paste
Project Introduction
Photovoltaic silver paste is a key material used in the manufacturing of photovoltaic cells, possessing excellent conductivity and photoelectric conversion efficiency.
Zhengneng Electronics is a specialized and innovative "small giant" enterprise, with a professional R&D team of masters and doctors, 13 years of R&D innovation, providing customers with one-stop solutions.
PERC Cell Product Solutions
Back Silver: The U-8820P series back silver paste is suitable for monocrystalline and polycrystalline silicon materials. The product features good printability, low wet weight, excellent thermal aging performance, good solderability, high adhesion, good compatibility with mainstream front silver paste and back aluminum paste on the market, and a wide co-firing window.
Main Grid: The N-87T series main grid silver paste has a wider sintering range, excellent tensile strength and aging resistance, low passivation layer corrosion, high open voltage, and good matching with fine grids.
| Recommended Process | |
|---|---|
| Ambient Temperature: 25℃ | Relative Humidity: 35%-75% |
| Applicable Substrate: Monocrystalline silicon/Polycrystalline silicon | |
| Printing Conditions: 250-300 Stainless Steel Mesh | |
| Drying Conditions: Belt dryer 180-220°C; 2-4 minutes | |
| Sintering Temperature: Belt sintering furnace, preheating (200-400℃) peak (760-860℃) | |
N-type TOPCon Cell Product Solutions
Main Grid: The ZN-86T series is a front main grid paste suitable for N-type cells. By adjusting the glass composition, the product reduces the contact resistance with the N-type cell and reduces recombination. The product features high welding reliability, high adhesion before and after aging, high compatibility with sub-grid paste, high conversion efficiency, and low cost.
Sub-grid: The ZN-91T series is a fine-grid paste suitable for N-type back surfaces. The product can be applied to different sheet resistance cell processes. At the same time, the product has good printability, high reliability, low wet weight, good aspect ratio, high conversion efficiency, and a wide process window.
| Recommended Process | |
|---|---|
| Ambient Temperature: 25℃ | Relative Humidity: 35%-75% |
| Applicable Substrate: TOPCon Cell | |
| Printing Conditions: 450~550 Stainless Steel Mesh | |
| Drying Conditions: Belt sintering furnace, drying zone (150-400C), sintering peak (720-780°C) | |
N-type HJT Cell Product Solutions
Main Grid: The HS-Z series silver paste has a wide welding window and high welding reliability.
Fine Grid: The HS-X series silver paste is a low-temperature curing paste suitable for N-type HJT cells. The fine grid product has excellent printability with good linearity and narrow line width, and superior electrical performance with low volume resistivity and contact resistance, resulting in high conversion efficiency.
| Recommended Process | |
|---|---|
| Ambient Temperature: 25℃ | Relative Humidity: 35%-75% |
| Applicable Substrate: HJT Cell | |
| Printing Conditions: 250~520 mesh Stainless Steel Mesh | |
| Drying Conditions: Drying oven 160°C 10min | |
| Curing Conditions: Drying oven 190°C 20min | |
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